Electronics Forum | Tue Jul 08 06:00:29 EDT 2003 | iman
As part of our process/quality improvement review, it was raised thru' our findings that its a good mfg practice to monitor the incoming solder paste quality (as part of the indirect materials). We get one-page "outgoing QC" vendor reports with each
Electronics Forum | Fri Feb 19 14:43:46 EST 1999 | Nithy
We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not be
Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram
Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach
| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833
Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon
| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
Electronics Forum | Sat Feb 20 09:56:22 EST 1999 | Tufty
| We are in the process of getting into no-clean paste and fluxes. One important issue in this is sodler balling. I have heard some people say that having a matte finish would help in having lesser solder balls and that the solder balls would not b
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
Electronics Forum | Fri Sep 21 10:56:38 EDT 2001 | davef
Not as such. Look at IPC-7525 �Stencil Design Guidelines� The issues are: area and aspect ratios. They relate the size of the aperture opening to the thickness of the stencil. Check the fine SMTnet Archives for guidelines.
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